LCTLaser TGV laser through-hole processing software empowers precision manufacturing

In cutting-edge fields such as advanced semiconductor packaging, MEMS devices, biochips, and RF components, through-glass via (TGV) technology is emerging as a pivotal process path for 3D packaging and heterogeneous integration. Compared to traditional through-silicon via (TSV) solutions, TGV glass substrates, with their superior dielectric properties, dimensional stability, and cost advantages, are experiencing rapid growth in demand across high-end packaging, optical communication, microfluidics, and other fields.
However, TGV through-hole machining poses stringent requirements on precision, edge chipping control, consistency, and machining efficiency. Leveraging over two decades of experience in motion control technology, Lingchen Technology has independently developed the LCTLaser TGV laser through-hole machining software. With industrial-grade high-precision control at its core, it integrates functions such as intelligent layout optimization, automated process editing, full-process data traceability, and modular design, providing a one-stop solution for TGV glass through-hole machining.
This software supports a maximum processing accuracy of ±5μm, featuring multi-axis collaborative control and a built-in oscilloscope function for real-time comparison of motion points and actual position errors. This ensures precise and controllable through-hole processing every time, providing reliable domestic software support for advanced semiconductor packaging.

LCTLaser TGV laser via processing software from Lingchen Technology specializes in the field of precision glass via processing, boasting core advantages such as industrial-grade ±5μm processing accuracy, multi-axis collaborative control, intelligent layout optimization, and full-process data traceability. Whether it's advanced semiconductor packaging TGV via array processing or precision drilling for MEMS devices and optical communication substrates, this software provides stable and efficient solutions. The built-in oscilloscope function allows for real-time comparison between motion points and actual errors, making debugging more intuitive. The modular design supports free customization of process parameters, adapting to glass substrates of different thicknesses and materials.

Lingchen Technology adheres to independent research and development, continuously optimizes algorithms, and provides enterprises with cost-effective TGV laser through-hole processing software solutions. In the future, we will continue to delve deeply into the field of industrial software, empowering advanced semiconductor packaging and precision glass processing!

Suzhou Lingchen Acquisition Computer Co., Ltd. was founded in 2006, operating under the business philosophy of creating value for customers and pursuing win-win cooperation. It supplies core components and system solutions for automation equipment including industrial computers, motion control systems, test & measurement devices, machine vision systems and robotics.

Lingchen owns two wholly-owned subsidiaries: Suzhou Xunya Automation Technology Co., Ltd. and TEO Robotics (Suzhou) Co., Ltd., specialized in robot sales as well as the R&D, production and sales of linear transmission products respectively.

Within the hierarchical framework of the automation control network, Lingchen Technology delivers complete products covering the equipment layer, control layer and information layer.

Lingchen industrial chassis feature robust industrial-grade structures, superior heat dissipation and dustproof design, delivering all-round physical protection for core computing units. They guarantee long-term stable operation under harsh industrial conditions with vibration, heavy dust and wide temperature fluctuations.

Lingchen embedded industrial PCs adopt compact and rugged industrial design, integrating high-performance computing, abundant I/O interfaces and wide temperature & voltage adaptability. Tailored for embedded scenarios such as machine vision and edge computing, they serve as stable and reliable intelligent cores within limited installation space, empowering smart manufacturing and IoT applications.

Lingchen motion control cards support up to 32 motion axes, with a maximum of 512 digital input (DI) and 512 digital output (DO) points. The shortest bus communication cycle reaches 250µs. Supported motion functions include single-axis relative/absolute motion, jogging, drive homing, multi-axis interpolation, multi-axis point table motion and electronic gearing.

Built on an open hard real-time kernel (jitter ＜ ±0.3µs), Lingchen LMC series motion controllers eliminate the non-real-time bottlenecks of traditional Windows platforms, ensuring deterministic and instant responses for multi-axis commands. Installation is extremely convenient via a single network cable. Adopting efficient asynchronous communication technology, it synchronizes and executes motion commands for up to 12 axes within 1 millisecond.

Centered on powerful bus expansion capability, Lingchen NAC controllers support 4 EtherCAT master stations, enabling precise control of 256 axes per station and a total of 4096 I/O points. It boasts comprehensive and advanced motion control functions: basic point positioning, linear & circular interpolation, plus five-axis interpolation, spline trajectory smoothing and dynamic coordinate systems. Integrated vibration suppression, soft landing and high-precision position comparison output are available, alongside 8 independent interpolation channels and continuous interpolation capacity to meet complex trajectory and high-speed synchronization requirements. The open and flexible development environment supports C++, C#, Python and other programming languages, allowing direct programming within the real-time system to greatly boost integration and debugging efficiency.

Complying strictly with PLCopen specifications and the IEC-61131-3 international standard, Lingchen PLC controllers combine high performance, compact size and modular design for easy development and flexible deployment. Widely applied to automation equipment and production line systems in 3C, lithium battery, packaging, printing and other industries, they can also be extended as network communication nodes in combined production lines for logistics, automotive and daily consumer goods. They fulfill demands such as internal/external network isolation, high-speed bus communication and real-time data processing, acting as stable and reliable control cores for diverse industrial scenarios.

Custom-engineered for harsh industrial environments, Lingchen industrial network cards support 10/100/1000Mbps adaptive transmission for stable high-speed network connectivity. Featuring anti-interference, surge protection and wide-temperature operation, they are widely adopted in critical scenarios including motion control, machine vision and automation systems. Equipped with standard full-height brackets and optional low-profile brackets for flexible installation, they can be integrated into a wide range of smart manufacturing equipment and industrial networks.

Lingchen Technology provides a full lineup of I/O module solutions to flexibly meet diverse industrial automation demands.

1.LC/LD Series Expandable I/O Modules: Compatible with multiple protocols including EtherCAT, Profinet, Ethernet/IP and Modbus TCP. Support flexible expansion of digital, analog, temperature, pressure and pulse acquisition modules, deployed across 3C, lithium battery, semiconductor, automotive, medical and other industries.

2.MINI Series I/O Modules: Compact form factor with high real-time performance, covering digital I/O, analog I/O, temperature and communication modules for control and data acquisition scenarios with strict space and latency requirements.

3.GWS Series Cabinet-External I/O Modules: Deliver high stability and convenient network wiring for distributed layouts, significantly cutting system integration time and costs.

The full product lineup delivers reliable, easy-to-integrate and multi-scenario adaptable I/O support for end users.