TOKK Linear Modules Power the AMB Coating Automatic Feeder

As semiconductor manufacturing continues to advance toward higher density and greater reliability, AMB (Active Metal Brazing) copper-clad ceramic substrates have become the core packaging material for high-end applications—such as IGBT power modules and electric vehicle control systems—thanks to their excellent thermal conductivity, thermal shock resistance, and high insulation performance. The plating process for AMB substrates is a critical step in enhancing the adhesion and corrosion resistance of the copper layer; the precision and stability of the automated feeding system directly impact product yield and production efficiency.

Designed for high rigidity, high repeatability, and long service life, TOKK linear modules perform the core tasks of handling, positioning, and transferring copper plates in AMB plating feeders, enabling fully automated, high-cycle, and stable operation of the front-end interface with semiconductor etching equipment.

The AMB plating process is primarily used in the front-end transfer stage of semiconductor etching equipment to apply a surface coating to copper plates. During this process, the copper plates undergo multiple steps, including adjustment by a basket elevator, conveyance via an telescopic belt conveyor, CCD vision alignment, pickup by a spider manipulator, carrier assembly, and final transfer into the plating machine. The precise handling of each copper plate from the basket to the carrier requires the moving components of the feeding system to possess extremely high positioning accuracy and operational stability.

In the AMB plating feeder, TOKK linear modules perform multiple tasks, including long-stroke precision handling and the lifting and positioning of carriers, covering the entire process from basket retrieval to carrier discharge.

①Long-stroke precision handling ensures the accurate movement of copper plates

TOKK linear modules feature an integrated design combining ball screws and linear guides, offering high precision and stability. They easily meet high-precision application requirements and operate stably to ensure the service life of the screws and slides as well as assembly quality. In plating feeders, linear modules are primarily responsible for the precise handling and positioning of copper sheets over long strokes.

② A high-rigidity embedded rail structure that meets precision positioning requirements

For processes with high rigidity requirements, such as vehicle lifting and positioning, the embedded rail structure of TOKK linear modules plays a critical role. The rails are embedded in the ground body, enabling a straightness tolerance of ±0.02 mm during travel and offering superior rigidity. After the copper plates are picked up by the spider manipulator and loaded onto the carrier, the carrier must undergo lifting, positioning, and precise alignment to ensure accurate positioning when it enters the plating machine.

Thanks to their high-rigidity structure and excellent straightness, TOKK linear modules provide stable and reliable support and positioning during this process, ensuring precise alignment between the carrier and the plating machine’s interface.

③ Multi-module coordination to cover the entire process of precision motion

TOKK linear modules form a complete motion chain within the plating feeder: they handle the long-stroke transport and positioning of copper plates from the basket to the CCD station, while also performing the final steps of lifting the carrier and ensuring its precise positioning.